Available Technology

Low Temperature Joining of Ceramic Composites

This invention provides a process for creating a toughened SiC filler and bonding material for joining continuous fiber ceramic composites (either similar or different in composition) at relatively low joining temperatures.
The process uses a solventless, three component bonding agent that promotes mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C.
Internal Laboratory Ref #: 
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