Adhesion Promoter (HMDS): YES 310TA


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HMDS (hexamethyldisilzane) promotes photoresist adhesion by creating a bond between the resist and silicon. The silizanes bond to the silicon in the wafer while the methyls bond with the photoresist. Vapor priming allows for HMDS application in a monolayer and reduces the chance of contamination.

Specifications / Capabilities:

Quality of Coating

  • Surface dehydration and subsequent vapor priming results in chemical bonding to surface hydroxyl ions, not weakly bound surface moisture
  • Reesulting coatings are repeatable and stable for extended periods

Efficiency of Chemical Usage

  • Uses less than 5 ml to coat up to 200 wafers
  • System uses pure HMDS so there is no possibility of variation due to changes in carrier concentration

Waste Disposal

  • Virtually no waste - no liquid solvents or residues to dispose of

Flexibility of Substrate Size and Shape

  • Any size and shape substrate can be treated with equal efficiency up to 16"
  • There are no issues with flow effects or substrate topology due to use of vapor

Flexibility of Type of Substrate

  • Delicate or difficult substrates can be accommodated with simple temperature or recipie changes
  • With no substrate movement during priming, there is no risk of breakage or other damage

HMDS is stored in the system under vacuum

  • Chemical does not degrade from exposure to moisture in the air
  • Operators are not exposed to fumes from the HMDS or carrier solvent
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